Method of encapsulating a chip

Details Method of encapsulating a chip Method of encapsulating a chip

1999-02-05

2000-07-04

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438127, H01L 2144, H01L 2148, H01L 2150

Patent

active

060837756

ABSTRACT:
A method of making a semiconductor package comprises applying a coating layer to a degating region of a substrate on which a runner and a gate of an encapsulating mold are located, allowing the adhesion between the coating layer and the surface of the substrate to be less than that between the coating layer and a molding compound subsequently molded over the coating layer. A semiconductor chip is then attached to the substrate followed by a cleaning treatment to the surfaces of the substrate and semiconductor chip. The semiconductor chip is then electrically connected to the substrate by wire bonding. After that, the molding compound is transfer molded to enclose the semiconductor chip and part of the surface of the substrate. The molding compound solidified and formed in the runner and gate of the encapsulating mold is then removed from the substrate by breaking away, together with the coating layer adhered thereto.

REFERENCES:
patent: 5542171 (1996-08-01), Juskey et al.
patent: 5635671 (1997-06-01), Freyman
patent: 5852870 (1998-12-01), Freyman
patent: 5961912 (1999-10-01), Huang
patent: 5981873 (1999-11-01), Heo

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