Electronic device packages having glass free non conductive laye

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174260, H05K 100

Patent

active

059818808

ABSTRACT:
A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.

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