Resist composition with polymeric dissolution inhibitor and alka

Details Resist composition with polymeric dissolution inhibitor and alka Resist composition with polymeric dissolution inhibitor and alka

1996-04-22

1998-06-02

Codd, Bernard P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430326, 430910, G03C 173

Patent

active

057597391

ABSTRACT:
A resist composition comprising an alkali-soluble resin, typically a partially t-butoxycarbonylated polyhydroxystyrene, a p-butoxystyrene/t-butylacrylate copolymer or p-butoxystyrene/maleic anhydride copolymer as a dissolution inhibitor, and a iodonium or sulfonium salt as a photoacid generator is effective for forming a resist film which can be precisely and finely patterned using high energy radiation such as a KrF excimer laser.

REFERENCES:
patent: 5324804 (1994-06-01), Steinmann
patent: 5332650 (1994-07-01), Murata et al.
patent: 5350660 (1994-09-01), Urano et al.
patent: 5356753 (1994-10-01), Yamada et al.
Patent Abstracts of Japan, JP 61-23971.
Patent Abstracts of Japan, JP 61-23970.

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