Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Patent
1996-08-30
1999-01-26
Chaudhari, Chandra
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
438 16, 438 17, G01R 3126
Patent
active
058638083
ABSTRACT:
The invention is predicated in an experimental finding that by setting the temperature in a wafer case, which is made of polypropyrene or like organic resin and in which wafers are stored, to -50.degree. to 15.degree. C., preferably to -50.degree. to 10.degree. C., it is possible to make the increase of organic materials attached during the storage of the wafers substantially to zero. The invention also concerns a method of determining the amount of organic materials attached to wafers, which comprises the steps of allowing a predetermined amount of water drop to be formed on the surface of a wafer, then measuring the angle .alpha. between the wafer and a line drawn from the contact point of 3 phases consisting of the water drop 10, the wafer 1 and gas on the wafer surface to the top of the water drop 10, and thereby obtaining the contact angle .theta. as .theta.=2.alpha., and then determining the amount of organic materials from the contact angle .theta..
REFERENCES:
patent: 5105628 (1992-04-01), Nakai
patent: 5551984 (1996-09-01), Tanahashi
Berry Renee R.
Chaudhari Chandra
Shin-Etsu Handotai & Co., Ltd.
LandOfFree
Method of storing and transporting wafers and method of determin does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of storing and transporting wafers and method of determin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of storing and transporting wafers and method of determin will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1449969