Method for forming a microelectronic assembly

Details Method for forming a microelectronic assembly Method for forming a microelectronic assembly

1996-11-19

1998-12-15

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 156243, 22818022, H05K 334

Patent

active

058484663

ABSTRACT:
A microelectronic assembly (10) is formed by bonding an integrated circuit component (20) to a substrate (12). The substrate (12) includes a via (22) and a metal contact (24) closing the via (22). A bonding agent (14), such as a solder paste or a conductive epoxy, is dispensed into the via (22) adjacent the metal contact (24). A carrier tape (16) that includes partially-cured films (18) is placed onto the substrate (12) such that the film (18) covers the via (22) and forms a gap (28) between the substrate (12) and the film (18). The integrated circuit component (20) is superposed onto the substrate (12) such that conductive bumps (26) on the integrated circuit component (20) perforate and extend through the film (18) and contact the bonding agent (14) in the via (22). Portions (44) displaced during perforation are received in the gap (28). The film (18) is thus interposed between the substrate (12) and the integrated circuit component (20). The preassembly (38) is then heated to bond the bonding agent (14) to the metal contact (24) and to cure the film (18) to form an integral assembly (10).

REFERENCES:
patent: 5262226 (1993-11-01), Yoshida
patent: 5384952 (1995-01-01), Matsui
patent: 5434452 (1995-07-01), Higgins, III
patent: 5681647 (1997-10-01), Caillat

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