System for protecting leads to a semiconductor chip package duri

Details System for protecting leads to a semiconductor chip package duri System for protecting leads to a semiconductor chip package duri

1991-06-28

1993-06-22

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 29854, 29855, 29856, 257787, 257678, H01L 2302, H01L 2328, H01R 4300

Patent

active

052218120

ABSTRACT:
After a semiconductor die is placed onto a leadframe and electrically connected to the die, the die and the ends of the leads adjacent to the die are encased in a packaged body. The exposed ends of the leads are trimmed so that the leads are of desired lengths for leadforming, or for connection to substrates or sockets. The ends of the leads are enclosed in a protective body, so that when the package is tested and handled, the protective body reduces undesirable bending of the leads. By trimming the leads before forming the protective body, the leadframe used need, not be larger than those normally used.

REFERENCES:
patent: 3219748 (1965-11-01), Miller
patent: 3778685 (1973-12-01), Kennedy
patent: 4701781 (1987-10-01), Sankhogowit
patent: 4788583 (1988-11-01), Kawahara et al.
patent: 4801561 (1989-01-01), Sankhogowit
patent: 4837184 (1989-06-01), Lin et al.
patent: 4897602 (1990-01-01), Lin et al.
patent: 5079673 (1992-01-01), Kodai et al.

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