Polishing method

Details Polishing method Polishing method

1988-10-11

1990-01-09

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

51283R, 51317, 156639, 156645, 156662, 156903, 252 791, 252 795, H01L 2306, B44C 122

Patent

active

048926124

ABSTRACT:
The process of polishing semiconductor materials such as silicon with a silica sol-amine combination is improved by selecting an alkanolamine as the amine. The alkanolamine can be added in higher proportions than the prior art suggests while maintaining a stable colloidal dispersion. The silica sol-alkanolamine combination can be diluted to extremely low silica contents while exhibiting a high pH and efficient polishing of silicon metal wafers.

REFERENCES:
patent: 3429080 (1969-02-01), Lachapelle

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