Process for manufacturing multilayer ceramic chip carrier module

Details Process for manufacturing multilayer ceramic chip carrier module Process for manufacturing multilayer ceramic chip carrier module

1981-10-02

1982-08-24

Hoffman, James R.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264 61, B32B 3106, C04B 3912, C04B 3510

Patent

active

043459552

ABSTRACT:
Preparing multilayer ceramic (MLC) modules by injection molding a mixture of a fine particulate such as alumina and a binder into a mold containing predesigned ridges and pins. The product is a green body layer of ceramic containing grooves and vias that is thereafter metallized with a conductive paste and laminated to other like layers of ceramic. Solvent extraction of the binder and sintering of the MLC forms the module.

REFERENCES:
patent: 3991029 (1976-11-01), Adelman
patent: 4101710 (1978-07-01), Marcus
patent: 4197118 (1980-04-01), Wiech

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