Tape carrier package

Details Tape carrier package Tape carrier package

1996-06-28

1998-03-10

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257786, 257787, H01L 23495

Patent

active

057264910

ABSTRACT:
A tape carrier package of the invention includes: an insulating film having a device hole; a conductor pattern formed on the insulating film; and conductor leads electrically connected to the conductor pattern and projected inward beyond the edge of the device hole, and the conductor leads is electrically connected to electrode pads of a semiconductor chip. In this arrangement, the electrode pads of the semiconductor chip are arranged in at least two rows which are parallel to opposite two sides of the semiconductor chip, the two opposite rows of pads are disposed closer to the center of the two rows than to the edge of semiconductor chip, and the element-forming surface of the entire semiconductor chip containing the region between the insulating film and the semiconductor chip, is sealed with a sealing resin, except the part of the electrode pads.

REFERENCES:
patent: 4812421 (1989-03-01), Jung et al.
patent: 5214845 (1993-06-01), King et al.
patent: 5227232 (1993-07-01), Lim
patent: 5598030 (1997-01-01), Imai et al.

Affiliated with

Also associated with

Rating

Tape carrier package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tape carrier package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape carrier package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-142108