Method for forming film by plasma CVD

Details Method for forming film by plasma CVD Method for forming film by plasma CVD

1994-10-19

1996-03-05

Resan, Stevan A.

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

427131, 427574, 427577, 427585, H05H 124, G11B 500

Patent

active

054965950

ABSTRACT:
A magnetic recording medium comprising a back coating layer formed on a surface reverse to a magnetic layer and a carbonaceous film which is formed on the back coating layer and contains fluorine atoms and silicon atoms and/or nitrogen atoms and in which a concentration of fluorine atoms decreases in a depth direction from a surface of the carbonaceous film, while a concentration of the silicon and/or nitrogen atoms increases in the depth direction from the surface of the carbonaceous film, which recording medium has improved running stability, durability and weatherability while electromagnetic conversion characteristics are maintained.

REFERENCES:
patent: 4551778 (1985-11-01), Arai et al.
patent: 4840844 (1989-06-01), Futamoto et al.
patent: 5192370 (1993-03-01), Oda et al.
patent: 5198263 (1993-03-01), Stafford et al.
patent: 5204138 (1993-04-01), Nguyen et al.
patent: 5275850 (1994-01-01), Kitoh et al.
patent: 5283087 (1994-02-01), Yamazaki et al.
patent: 5302424 (1994-04-01), Murai et al.
patent: 5328737 (1994-07-01), Takahashi et al.
Database WPI Week 9213, Derwent Publications Ltd., London, GB; AN 92-102837 & JP-A-4 049 520 (Matsushita Elec. Ind.) 18, Feb. 1992.
Database WPI Week 8152, Derwent Publications Ltd., London, GB; AN 8196094D & JP-A-56 148 732 (Matsushita Elec. Ind.) 18, Nov. 1981.

Affiliated with

Also associated with

Rating

Method for forming film by plasma CVD does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming film by plasma CVD, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming film by plasma CVD will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1411497