Coating processes – With post-treatment of coating or coating material – Heating or drying
Patent
1994-08-11
1996-03-05
Dudash, Diana
Coating processes
With post-treatment of coating or coating material
Heating or drying
427 96, 4273884, B05D 302, B05D 512
Patent
active
054965900
ABSTRACT:
A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.
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Furukawa Yoshiaki
Haruta Takashi
Maki Yoshiro
Nakagawa Toshiko
Nakamura Sachiko
Dudash Diana
MEC Co. Ltd.
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