Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1995-11-07
1997-05-13
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257724, 257725, 257528, 257531, 257532, 257536, H07L 4902
Patent
active
056295634
ABSTRACT:
A multi-chip packaging arrangement that contemplates stacking discrete components over film based components is disclosed. The multi-chip package includes a substrate having one or more film based components formed thereon. A discrete component is mounted on the substrate over the film based component such that it is electrically isolated from the film based component. One or more die components are also mounted on the substrate and a plurality of leads are provided for electrically connecting the multi-chip package to external circuitry. Wiring traces formed on the substrate are provided to electrically connect various ones of the components and the leads. A packaging material is provided to encapsulate the components and the wiring traces and leaves a portion of the leads exposed to facilitate electrically connecting the multi-chip package to external circuitry. Methods of making such multi-chip packages are also disclosed.
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Crozier James L.
Delateur Martin A.
Hegel Uli H.
Hou-Chang Michelle M.
Spalding Peter H.
Crane Sara W.
Hardy David B.
National Semiconductor Corporation
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