Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1996-08-15
1998-03-10
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566281, 1566301, 216 2, 216 11, 437228, 437901, H01L 213105
Patent
active
057257299
ABSTRACT:
An improved process for fabricating micromechanical devices having movable members, such as gyros and accelerometers. A starting wafer includes an oxidized silicon wafer which has been wafer bonded to a second silicon wafer which has a thin N layer on a P substrate. The wafer is patterned, doped and etched in a series of process steps which include the deposition of epitaxial layers to configure critical device dimensions and geometry. Metallizations are deposited for electrical/electronic interconnections. The process includes an ability to integrate on-chip electronics on the silicon substrate. Alignment difficulties and thermal mismatch associated with prior art processes are minimized.
REFERENCES:
patent: Re32931 (1989-05-01), Staudte
patent: Re33479 (1990-12-01), Juptner et al.
patent: 3053095 (1962-09-01), Koril et al.
patent: 3251231 (1966-05-01), Hunt et al.
patent: 3370458 (1968-02-01), Dillon
patent: 3696429 (1972-10-01), Tressa
patent: 3913035 (1975-10-01), Havens
patent: 4044305 (1977-08-01), Oberbeck
patent: 4122448 (1978-10-01), Martin
patent: 4144764 (1979-03-01), Hartzell, Jr.
patent: 4155257 (1979-05-01), Wittke
patent: 4234666 (1980-11-01), Gursky
patent: 4321500 (1982-03-01), Paros et al.
patent: 4336718 (1982-06-01), Washburn
patent: 4342227 (1982-08-01), Petersen et al.
patent: 4381672 (1983-05-01), O'Connor et al.
patent: 4406992 (1983-09-01), Kurtz et al.
patent: 4411741 (1983-10-01), Janata
patent: 4414852 (1983-11-01), McNeill
patent: 4447753 (1984-05-01), Ochiai
patent: 4468584 (1984-08-01), Nakamura et al.
patent: 4478076 (1984-10-01), Bohrer
patent: 4478077 (1984-10-01), Bohrer et al.
patent: 4483194 (1984-11-01), Rudolf
patent: 4484382 (1984-11-01), Kawashima
patent: 4490772 (1984-12-01), Blickstein
patent: 4495499 (1985-01-01), Richardson
patent: 4499778 (1985-02-01), Westhaver et al.
patent: 4502042 (1985-02-01), Wuhrl et al.
patent: 4522072 (1985-06-01), Sulouff et al.
patent: 4524619 (1985-06-01), Staudte
patent: 4538461 (1985-09-01), Juptner et al.
patent: 4585083 (1986-04-01), Nishiguchi
patent: 4590801 (1986-05-01), Merhav
patent: 4592242 (1986-06-01), Kempas
patent: 4596158 (1986-06-01), Strugach
patent: 4598585 (1986-07-01), Boxenhorn
patent: 4600934 (1986-07-01), Aine et al.
patent: 4619001 (1986-10-01), Kane
patent: 4621925 (1986-11-01), Masuda et al.
patent: 4628283 (1986-12-01), Reynolds
patent: 4629957 (1986-12-01), Walters et al.
patent: 4639690 (1987-01-01), Lewis
patent: 4644793 (1987-02-01), Church
patent: 4651564 (1987-03-01), Johnson et al.
patent: 4653326 (1987-03-01), Danel et al.
patent: 4654663 (1987-03-01), Alsenz et al.
patent: 4665605 (1987-05-01), Kempas
patent: 4670092 (1987-06-01), Motamedi
patent: 4671112 (1987-06-01), Kimura et al.
patent: 4674180 (1987-06-01), Zavracky et al.
patent: 4674319 (1987-06-01), Muller et al.
patent: 4674331 (1987-06-01), Watson
patent: 4679434 (1987-07-01), Stewart
patent: 4680606 (1987-07-01), Knutti et al.
patent: 4699006 (1987-10-01), Boxenhorn
patent: 4705659 (1987-11-01), Bernstein et al.
patent: 4706374 (1987-11-01), Murkami
patent: 4712439 (1987-12-01), North
patent: 4727752 (1988-03-01), Peters
patent: 4735506 (1988-04-01), Pavlath
patent: 4736629 (1988-04-01), Cole
patent: 4743789 (1988-05-01), Puskas
patent: 4744248 (1988-05-01), Stewart
patent: 4744249 (1988-05-01), Stewart
patent: 4747312 (1988-05-01), Herzl
patent: 4750364 (1988-06-01), Kawamura et al.
patent: 4761743 (1988-08-01), Wittke
patent: 4764244 (1988-08-01), Chitty et al.
patent: 4776924 (1988-10-01), Delapierre
patent: 4783237 (1988-11-01), Aine et al.
patent: 4789803 (1988-12-01), Jacobsen et al.
patent: 4792676 (1988-12-01), Hojo et al.
patent: 4805456 (1989-02-01), Howe et al.
patent: 4808948 (1989-02-01), Patel et al.
patent: 4834538 (1989-05-01), Heeks et al.
patent: 4851080 (1989-07-01), Howe et al.
patent: 4855544 (1989-08-01), Glenn
patent: 4869107 (1989-09-01), Murakami
patent: 4882933 (1989-11-01), Petersen et al.
patent: 4884446 (1989-12-01), Ljung
patent: 4890812 (1990-01-01), Chechile et al.
patent: 4893509 (1990-01-01), MacIver et al.
patent: 4898032 (1990-02-01), Voles
patent: 4899587 (1990-02-01), Staudte
patent: 4900971 (1990-02-01), Kawashima
patent: 4901586 (1990-02-01), Blake et al.
patent: 4916520 (1990-04-01), Kurashima
patent: 4922756 (1990-05-01), Henrion
patent: 4929860 (1990-05-01), Hulsing, II et al.
patent: 4981359 (1991-01-01), Tazartes et al.
patent: 5001383 (1991-03-01), Kawashima
patent: 5016072 (1991-05-01), Greiff
patent: 5025346 (1991-06-01), Tang
patent: 5038613 (1991-08-01), Takenaka et al.
patent: 5060039 (1991-10-01), Weinberg et al.
patent: 5090809 (1992-02-01), Ferrar
patent: 5094537 (1992-03-01), Karpinski, Jr.
patent: 5138883 (1992-08-01), Paquet et al.
patent: 5195371 (1993-03-01), Greiff
patent: 5203208 (1993-04-01), Bernstein
patent: 5205171 (1993-04-01), O'Brien et al.
patent: 5216490 (1993-06-01), Greiff et al.
patent: 5226321 (1993-07-01), Varnham et al.
patent: 5233874 (1993-08-01), Putty et al.
patent: 5241861 (1993-09-01), Hulsing, II
patent: 5369544 (1994-11-01), Mastrangelo
patent: 5535902 (1996-07-01), Greiff
patent: 5591678 (1997-01-01), Bendik et al.
Barth, P.W. et al., "A Monolithic Silicon Accelerometer With Integral Air Damping and Overrange Protection," 1988 IEEE, pp. 35-38.
Boxenhorn, B., et al., "An Electrostatically Rebalanced Micromechanical Accelerometer," AIAA Guidance, Navigation and Control Conference, Boston, Aug. 14-16, 1989, pp. 118-122.
Boxenhorn, B., et al., "Micromechanical Inertial Guidance System and its Application," Fourteenth Biennial Guidance Test Symposium, vol. 1, Oct. 3-5, 1989, pp. 113-131.
Boxenhorn, B., et al., "Monolithic Silicon Accelerometer," Transducers '89, Jun. 25-30, 1989, pp. 273-277.
Boxenhorn, B., et al., "A Vibratory Micromechanical Gyroscope," AIAA Guidance, Navigation and Control Conference, Minneapolis, Aug. 15-17, 1988, pp. 1033-1040.
Howe, R., et al., "Silicon Micromechanics: Sensors and Actuators On a Chip," IEEE Spectrum, Jul. 1990, pp. 29-35.
Moskalik, L., "Tensometric Accelerometers with Overload Protection," Meas. Tech (USA), vol. 22, No. 12, Dec. 1979 (publ. May 1980), pp. 1469-1471.
Nakamura, M., et al., "Novel Electrochemical Micro-Machining and Its Applicatio for Semiconductor Acceleration Sensor IC," Digest of Technical Papers (1987) Institute of Electrical Engineers of Japan, pp. 112-115.
Petersen, K.E. et al., "Micromechanical Accelerometer Integrated with MOS Detection Circuitry," IEEE, vol. ED-29, No. 1 (Jan. 1982), pp. 23-27.
Petersen, Kurt E., et al., "Silicon as a Mechanical Material," Proceedings of the IEEE, vol. 70, No. 5, May 1982, pp. 420-457.
"Quartz Rate Sensor Replaces Gyros," Defense Electronics, Nov. 1984, p. 177.
Rosen, Jerome, "Machining In the Micro Domain," Mechanical Engineering, Mar., 1989, pp. 40-46.
Teknekron Sensor Development Corporation, article entitled "Micro-Vibratory Rate Sensor," 1080 Marsh Road, Menlo Park, CA 94025, 2 pages, undated.
Bryzek, Janusz et al., "Micromachines on the March," IEEE Spectrum, May 1994, pp. 20-31.
IEEE Robotics & Automation Soc. in coop. w/ASME Dynamic Systems & Control Div., "Micro Electro Mechanical Systems, An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems," IEEE Cat. #93CH3265-6, Library of Congress #92-56273, Ft. Lauderdale, FL, Feb. 7-Oct. 1993.
Alanko Anita
Breneman R. Bruce
The Charles Stark Draper Laboratory Inc.
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