Process for forming contact through holes

Details Process for forming contact through holes Process for forming contact through holes

1981-02-13

1982-10-19

Kimlin, Edward C.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156651, 1566591, 430316, B44C 122, H01L 21306

Patent

active

043548970

ABSTRACT:
A process for forming a contact through-hole in an insulating layer lying between multilayer conductors comprises the steps of: forming a photoresist layer on the insulating layer with an aperture therein exposing, and defining, the position of a through-hole to be found in the insulating layer; wet-etching the insulating layer in the portion exposed by the aperture to form a preceding hole; heating the photoresist layer to bend the end portion of the photoresist layer into the preceding hole but to a limited extent such that the end portion does not come into contact with sloped side wall of the preceding hole; and dry-etching the insulating layer to complete the etching of the contact through-hole while maintaining the desired, sloped sidewall thereof, thereby preventing cracks from occurring in the upper one of the multilayer conductors in the portions thereof which extend through the through-hole.

REFERENCES:
patent: 3544401 (1970-12-01), Jarman
patent: 3695955 (1972-10-01), Jochems et al.

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