Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Patent
1998-03-26
2000-07-25
Meeks, Timothy
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
216 68, 216 71, 156345, 438710, 438729, H05H 146
Patent
active
060934573
ABSTRACT:
A plasma processing method includes controlling a pressure of an interior of a vacuum chamber to a specified pressure by exhausting the interior of the vacuum chamber while supplying gas into the interior of vacuum chamber. While the pressure of the interior of the vacuum chamber is being controlled, high-frequency power is supplied to one end of a first conductor which is opened at another end, and which is configured as a vortex. Also, grounding one end of a second conductor which is opened at another end and which is configured as a vortex. Finally, electromagnetic waves from the first conductor and the second conductor radiate into the vacuum chamber, generating plasma in the vacuum chamber and processing a substrate placed on an electrode within the vacuum chamber.
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patent: 5693238 (1997-12-01), Schmitt et al.
Proceedings of Symposium on Dry Process(1996), "Characteristics of Stabilized Pulsed Plasma Via Suppression of Side Band Modes", Hahm et al., pp. 29-35 (no month).
Processings of Symposium on Dry Process (1996) "Characteristics of Stabilized Pulsed Plasma Vai Suppression of Side Band modes" by J.H. Hahm et al., pp. 29-35 (no month).
"Basic Engineering of Plasma", p. 58, by Sinriki Teii, Uchida Rokakuho Publishing Co., Ltd. 1986) (no month).
"New Ultra-High-Frequency Plasma Source for Large-Scale Etching Processes", Jpn. J. Appl. Phys., Vo. 34, Pt. 1, No. 12B (1995) by Samukawa et al. (no month).
Nakayama Ichiro
Okumura Tomohiro
Matsushita Electric - Industrial Co., Ltd.
Meeks Timothy
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