Method employing laser ablating for providing a pattern on a sub

Details Method employing laser ablating for providing a pattern on a sub Method employing laser ablating for providing a pattern on a sub

1994-11-22

1996-04-09

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

216 65, 216 94, H01B 1300, B44C 122, C23F 100

Patent

active

055053203

ABSTRACT:
A pattern is provided on a substrate by providing the substrate with at least two layers of material thereon and providing a layer of dry imaging polymer compositions thereon. The layer of the dry imaging polymer composition is laser ablated to provide the desired personality pattern. The top exposed portion of at least the top layer is removed and the desired select pattern is laser ablated. The exposed portions of said first layer is removed and the pattern is completed through the other layers of material to thereby expose the substrate surface, without the substrate surface being subjected to laser ablating to thereby provide the desired pattern on the substrate.

REFERENCES:
patent: 4414059 (1983-11-01), Blum et al.
patent: 4490211 (1984-12-01), Chen et al.
patent: 4568632 (1986-02-01), Blum et al.
patent: 5104480 (1992-04-01), Wojnarowski et al.
patent: 5236551 (1993-08-01), Pan
Laser Ablation of Thin Chromium Layer, Abstract--Research Disclosure, 1988, No. 292, Kenneth Mason Publications Ltd., England (29267).

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