4. Etching a substrate: processes
  5. Forming or treating electrical conductor article

Robert D. Sebesta

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Electronic package for electronic components and method of...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Electronic package with high density interconnect layer

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Electronic package with multilevel connections

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Fine pitch circuitization with filled plated through holes

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Fine pitch circuitization with filled plated through holes

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-267245

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