Semiconductor element module and semiconductor device which prev

Details Semiconductor element module and semiconductor device which prev Semiconductor element module and semiconductor device which prev

1998-08-24

1999-11-16

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257697, 257730, 257692, H01L 2348

Patent

active

059863374

ABSTRACT:
A semiconductor element module includes a package, a semiconductor element arranged on the package, and a plurality of leads provided on sides of the package so that an opening end of each the lead is oriented to the side of a package attaching plane, and serving to connect the semiconductor element to an external circuit; wherein a level differences is provided on the side of the package attaching plane of each of package sides so that a space is formed from each the plurality of leads.

REFERENCES:
patent: 4868638 (1989-09-01), Hirata et al.
patent: 5398165 (1995-03-01), Niinou
patent: 5567984 (1996-10-01), Zalesinski et al.
Article issued by Ohm, "Handbook for Electronics and Communication Engineers," Electric-Communication Hand Book, dated Mar. 30, 1979, cover pages, and p. 577.

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