Method and apparatus for bond testing

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen

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73150A, G01N 308

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active

048935131

ABSTRACT:
In an apparatus and method for measuring the strength of an adhesive bond, a dispenser applies adhesive to a substrate for a prescribed period of time, a conveyor moves the substrate to a compressing station within a preselected open time, after which time a compressor compresses the substrate against another substrate to form an adhesive bond therebetween, the bond being formed under a substantially constant compression force and for a preselected compression time. During the latter portion of the compression time, the bonded substrates are moved together at a substantially constant rate of speed through a transition distance, one of the substrates contacting a stop plate at the end of the compression time to prevent further movement while the other of the substrates continues at the substantially costant rate of speed to break the bond. A load cell measures the maximum pull force required to break the bond and also provides a real time analog signal for the pull force of the bond during tension, thereby to obtain an indication of the total energy expended in breaking the bond.

REFERENCES:
patent: 3253461 (1966-05-01), Blanchard et al.
patent: 3580065 (1971-05-01), Strittmater et al.
patent: 4637252 (1987-01-01), Rhee et al.

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