High density electrical connectors

Details High density electrical connectors High density electrical connectors

1997-12-19

2000-03-28

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

257686, H01R 909

Patent

active

060423919

ABSTRACT:
A self-aligning, flexible high density and impedance adjusted electrical connectors for use in microelectronic systems for overcoming the problem of having electrical connection and alignment at the same time is disclosed. The connector comprises a first part (204) consisting of two metal layer structures, a first signal path (212) and a first ground path (210) covering a V-groove (202), and a second part (208) consisting of corresponding metal layers of the first part, a second signal path (224) covering an elastic bump (206) and a second signal ground plane (226) which fits into the V-groove (202). The first and the second signal paths are in contact with each other when the first and the second parts are brought together and the contact is self-aligning when put together. The electrical contact will remain despite displacement due to thermal expansion.

REFERENCES:
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patent: 3553633 (1971-01-01), Ondrejka
patent: 5071363 (1991-12-01), Reylek et al.
patent: 5097101 (1992-03-01), Trobough
patent: 5118299 (1992-06-01), Burns et al.
patent: 5121299 (1992-06-01), Frankeny et al.
patent: 5340296 (1994-08-01), Schreiber et al.
patent: 5525065 (1996-06-01), Sobhani
patent: 5743747 (1998-04-01), Sobhani
PCT International Search Report, Dec. 19, 1996.

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