Method for planarizing a non planar layer

Details Method for planarizing a non planar layer Method for planarizing a non planar layer

1996-09-25

1999-03-09

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430318, 438697, 216 38, G03F 700

Patent

active

058798625

ABSTRACT:
A method for planarizing a non-planar layer includes the steps of (a) forming a dielectric layer on top of the non-planar layer, the dielectric layer having protuberances due to the non-planar layer; (b) applying a seed layer on top of the dielectric layer, the seed layer having humps due to the protuberances of the dielectric layer; (c) forming a photoresist layer on top of the seed layer; (d) patterning and partially removing portions of the photoresist layer to thereby expose parts of a top surface of the seed layer; (e) forming a conductive layer on top of each of the exposed parts of the seed layer; (f) removing remaining portions of the photoresist layer until the seed layer thereunder is exposed; (g) removing parts of the photoresist layer still remaining, the seed layers protruding between the conductive layers and parts of the dielectric layer in such a way that the protuberances in the dielectric layer are completely removed; and (h) removing each conductive layer and the seed layer thereunder.

REFERENCES:
patent: 4689113 (1987-08-01), Balasubramanyam et al.
patent: 4783238 (1988-11-01), Roesner et al.
patent: 5053318 (1991-10-01), Gulla et al.
patent: 5149615 (1992-09-01), Chakravorty et al.
patent: 5284804 (1994-02-01), Moslehi

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