Inductively coupled plasma powder vaporization for fabricating i

Details Inductively coupled plasma powder vaporization for fabricating i Inductively coupled plasma powder vaporization for fabricating i

1998-03-02

2000-03-28

Beck, Shrive

Coating apparatus

Gas or vapor deposition

With treating means

118715, C23C 1600

Patent

active

060417358

ABSTRACT:
An apparatus and method for performing material deposition on semiconductor devices. The apparatus provides an enclosure for defining a chamber. The chamber includes a metallic portion such as a conductor coil powered by a voltage generator. A gas, having a suspension of particles for treating the semiconductor devices, is introduced into the chamber and the powered conductor coil converts the gas to inductively coupled plasma and vaporizes the particles. The particles can then be deposited on the semiconductor devices.

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