Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Patent
1996-11-04
1998-09-08
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
257666, 257724, 257784, H01L 2348, H01L 2352, H01L 2940, H01L 23495
Patent
active
058048804
ABSTRACT:
Disclosed is a lead frame and method for making a lead frame that is at least partially coated with a non-wettable material that is substantially anti-adhesive to solder materials. Once the non-wetting layer is applied to the lead frame, selected regions of the lead frame are plated with a wettable material that is solderable and bondable. In this manner, a solder paste may be used to attach a discrete component to selected regions of the wettable material, and wire bonds may be attached to other regions of the wettable material. Advantageously, the solder material is substantially prevented from spreading over portions of the lead frame coated with the non-wettable material.
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Unknown, "DC/DC Converter in IC Package Eases Power Supply Design-in," Package Technology Newsletter, National Semiconductor Corp., vol. 2, No. 3, Summer 1996.
Arroyo Teresa M.
Jackson Jerome
National Semiconductor Corporation
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