Semiconductor packaging

Details Semiconductor packaging Semiconductor packaging

1987-06-01

1989-06-13

James, Andrew J.

357 73, 357 84, H01L 2302, H01L 2308, H01L 2348

Patent

active

048397164

ABSTRACT:
A semiconductor package of the small outlined integrated circuit type is disclosed having an angled glass sealing surface. Another aspect of the invention relates to a shield disposed in a semiconductor package to prevent alpha radiation emitted from the sealing glass or other packaging components from impinging on the housed semiconductor device.

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