Interconnection with integrated corrosion stop

Details Interconnection with integrated corrosion stop Interconnection with integrated corrosion stop

1998-04-24

2000-08-29

Loke, Steven H.

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257753, 257758, 257761, 257762, 257764, 257765, 257771, H01L 2900, H01L 2348, H01L 2352, H01L 2940

Patent

active

061113018

ABSTRACT:
An interconnection structure for a semiconductor circuit is provided employing a conductor structure electrically connected to conductive wiring located on a different level than the conductor structure. The conductor structure comprises a relatively low resistivity metal. A barrier layer of a corrosion resistant metal is located intermediate the relatively low resistivity metal and wiring to thereby separate the wiring and relatively low resistivity metal.

REFERENCES:
patent: 5262354 (1993-11-01), Cote et al.
patent: 5300813 (1994-04-01), Joshi et al.
patent: 5399507 (1995-03-01), Sun
patent: 5599747 (1997-02-01), Bhatt et al.
patent: 5612254 (1997-03-01), Mu et al.
patent: 5712206 (1998-01-01), Chen
patent: 5760674 (1998-06-01), Gilmour et al.
patent: 5851903 (1998-12-01), Stamper

Affiliated with

Also associated with

Rating

Interconnection with integrated corrosion stop does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnection with integrated corrosion stop, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnection with integrated corrosion stop will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1252704