Wire shape conferring reduced crosstalk and formation methods

Details Wire shape conferring reduced crosstalk and formation methods Wire shape conferring reduced crosstalk and formation methods

1997-03-13

2000-08-29

Thomas, Tom

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438673, 438701, 257758, 257773, H01L 21461, H01L 214763, H01L 23485

Patent

active

061108243

ABSTRACT:
Capacitive coupling, and attendant cross-talk, is reduced by increasing the distance between wire surfaces in integrated circuit applications. This is done by changing wire shape from the conventional rectangular cross-section. A cross-section which consists of a rectangular portion and a shaped, triangular portion is created, having the effect of increasing the effective distance between adjacent conductors. Cross-sectional area of wires is maintained and thus the current carrying capacity is maintained. The wire shapes may be produced using several alternate methods.

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