Method of planarizing a semiconductor device surface

Details Method of planarizing a semiconductor device surface Method of planarizing a semiconductor device surface

1991-04-01

1992-08-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156657, 1566591, 156646, B44C 122, B29C 3700, C03C 1500, C03C 2506

Patent

active

051396084

ABSTRACT:
A method of planarizing an irregular surface (16) of a semiconductor device uses a mask (17) that is a reverse image of the surface (16). The mask (17) and the surface (16) are isotropically etched at substantially equal rates thereby eroding the mask (17) away from the surface (16) to increase the portion of the surface (16) that is being etched. The controlled eroding of the mask (17) gradually increases the amount of semiconductor material exposed to the etching as the etching is performed thereby substantially planarizing the surface (16).

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patent: 4676868 (1987-06-01), Riley et al.
patent: 4816112 (1989-03-01), Brooks et al.
patent: 4952274 (1990-08-01), Abraham

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