Abrading – Abrading process
Patent
1997-11-10
2000-08-29
Scherbel, David A.
Abrading
Abrading process
451 57, 451288, 451285, B24B 722
Patent
active
061100110
ABSTRACT:
A fabrication tool integrates one or more electrodeposition stations with a CMP apparatus. The tool may transport substrates from the electroplating stations to the CMP apparatus without an intervening cleaning step. In addition, the thickness of an electrodeposited layer may be measured at a metrology station prior to polishing utilizing an instrument which physically contacts the surface of the substrate, and the measured thickness may be used to adjust the polishing parameters. Furthermore, the fabrication tool may have a single interface in which a dry and clean wafer is returned to the interface.
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Adams Bret W.
Ghosh Debabrata
Somekh Sasson
Applied Materials Inc.
Scherbel David A.
Wilson Lee
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