Radiation-sensitive composition containing a resole resin, a nov

Details Radiation-sensitive composition containing a resole resin, a nov Radiation-sensitive composition containing a resole resin, a nov

1994-08-29

1995-11-14

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430270, 430302, 430157, 430271, 430920, 430926, G03C 176

Patent

active

054665574

ABSTRACT:
A radiation-sensitive composition especially adapted to prepare a lithographic printing plate that is sensitive to both ultraviolet and infrared radiation and capable of functioning in either a positive-working or negative-working manner is comprised of (1) a resole resin, (2) a novolac resin, (3) a latent Bronsted acid, (4) an infrared absorber, and (5) terephthalaldehyde. The solubility of the composition in aqueous alkaline developing solution is both reduced in exposed areas and increased in unexposed areas by the steps of imagewise exposure to activating radiation and heating.

REFERENCES:
patent: 4189323 (1980-02-01), Buhr
patent: 4247611 (1981-01-01), Sander et al.
patent: 4693958 (1987-09-01), Schwartz et al.
patent: 4708925 (1987-11-01), Newman
patent: 4927741 (1990-05-01), Garth et al.
patent: 4946759 (1990-08-01), Doessel et al.
patent: 5085972 (1992-02-01), Vogel
patent: 5114577 (1992-05-01), Kurano et al.
patent: 5149613 (1992-09-01), Stahlhofen et al.
patent: 5238781 (1993-08-01), Schadeli

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