Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1994-04-04
1995-11-14
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156633, 156645, 156648, 156651, 156663, 156667, 156643, B44C 122, C03C 1500
Patent
active
054663326
ABSTRACT:
A novel method etching through a substrate (e.g. BST 22) comprises removi A n5 Vthick substrate material from the backside of the substrate to form vias (e.g. cavity 24) all the way to the back surface of a frontside thin film (e.g. optical coating 20). To prevent damage to the frontside thin film while etching from the backside of the supporting substrate, the periphery of each frontside pixel is surrounded by a trench (e.g. etch stop trench 30) much deeper than the thickness of the thin film but also significantly shallower than the thickness of the substrate. This trench is then filled with an etch stop material (e.g. photoresist 32). This etch stop may be partially removed by the backside etching method but provides a tolerant means of recognizing when to stop etching before frontside film damage occurs. After etching the substrate down to and partially through the etch stop, the assembly is removed from the substrate etching medium. The remaining etch stop material may be removed with a specific agent which does not damage the frontside film. For example, if the etch stop is an organic material, such as photoresist, it may be removed from the back with a suitable solvent or dry etch without damaging either the substrate or the frontside thin film.
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Belcher James F.
Owen Robert A.
Carlson Brian A.
Donaldson Richard L.
Kesterson James C.
Powell William
Texas Instruments Incorporated
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