Method and apparatus for making optical devices

Details Method and apparatus for making optical devices Method and apparatus for making optical devices

1991-11-04

1993-01-12

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156647, 156653, 156657, 1566591, 156662, 156285, 156382, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

051787237

ABSTRACT:
A holder member (32) is made with a configuration of indentations (33) corresponding to the indentations (24, 25) on a substrate (23) within which optical elements (11-14, 16-19) are to be bonded. Vacuum channels (34) are made in the holder member, each communicating with one of the holder indentations (33), through which a vacuum is applied to temporarily hold the optical elements in place. The substrate containing the indentations or grooves within which optical elements are to be bonded is then positioned above the optical elements mounted in the holder member (FIG. 8). The optical elements are simultaneously bonded to the substrate by lowering the substrate to contact the elements to effect the bond. After bonding, the holder vacuum is released and the substrate (23) is withdrawn with all of the optical elements (11-14, 16-19) bonded to it.

REFERENCES:
patent: 5017263 (1991-05-01), Clark
"Slow and Steady Wins the Race", by A. Chu, Bell Labs News, Dec. 18, 1990, Page 5.
"An Automated Flip-Chip Assembly Technology for Advanced VLSI Packaging", by M. K. Bartschat, 38th Electronic Components Conference Proceedings, Los Angeles, Calif., May 9-11, 1988, pp. 335-341.

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