Method of etching circuit boards and recovering copper from the

Details Method of etching circuit boards and recovering copper from the Method of etching circuit boards and recovering copper from the

1981-10-29

1983-03-29

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

75117, 156642, 156656, 156666, 204106, 252 794, 252147, C23F 100, C23F 102

Patent

active

043782701

ABSTRACT:
The present invention relates to a method of etching copper with a hydrogen peroxide-sulfuric acid etchant containing an acid soluble phosphonic acid in the manufacture of electronic circuits utilizing a masked copper surface and to a method of recovering the copper from the spent etch solution by electrolysis in solid continuous form saleable as electrolytic copper.

REFERENCES:
patent: 4144119 (1979-03-01), Dutkewych et al.

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