Method of manufacturing magnetic sensor comprising at least two

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156646, 156653, 156656, 156657, 1566591, 1566611, 252 791, 365 8, 365 32, 427130, 427131, 430313, 430316, 430317, 430318, C23F 102, B44C 122, C03C 1500, C03C 2506

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044708734

ABSTRACT:
A magnetic sensor including first and second electromagnetic elements arranged one on the other is manufactured by depositing on a glass substrate a first magnetoresistive film of Fe-Ni permalloy, an insulating film of SiO.sub.2 and a second magnetoresistive film of Fe-Ni permalloy successively in this order and then these three films are simultaneously etched by a single etching treatment with aid of a photomask to form first and second magnetoresistive elements. Then, through-holes are formed in the second magnetoresistive film and insulating film to expose parts of the first magnetoresistive film. Next, an insulating photoresist film of polyimide is applied on the second magnetoresistive film and openings are formed in the insulating photoresist film at positions of the bottom of the through-holes and at positions corresponding to junctions to the second magnetoresistive film. After applying a metal film on the insulating photoresist film, the metal film is etched to form a conductor pattern serving as electrode conductors connected to the first and second magnetoresistive elements.

REFERENCES:
patent: 4187553 (1980-02-01), Ahn et al.
patent: 4272348 (1981-06-01), Cox et al.
patent: 4299680 (1981-11-01), Fontana et al.
patent: 4334951 (1982-06-01), Wagner
patent: 4358339 (1982-11-01), Oeffinger et al.
IBM Technical Disclosure Bulletin, vol. 18, No. 12, May 1976, pp. 4212-4213, Single Exposure Bubble Device Fabrication, by K. Y. Ahn.
IBM Technical Disclosure Bulletin, vol. 18, No. 10, Mar. 1976, pp. 3508-3509, High-Yield Process for Single-Level Mask Bubble Devices, by K. Y. Ahn et al.

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