Lead frame for integrated circuits and method of fabricating the

Details Lead frame for integrated circuits and method of fabricating the Lead frame for integrated circuits and method of fabricating the

1982-09-27

1985-06-11

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 68, 174 52FP, H01L 2348, H01L 2304

Patent

active

045232180

ABSTRACT:
A lead frame for integrated circuits has a central opening in which there is fitted a metal piece having alternate recesses and projections, the recesses fitting over inner ends of leads of the lead frame and the projections fitting in gaps between the inner lead ends. The metal piece includes slots and cut-outs to allow its comb-shaped members to bend independently of each other. After the lead frame had been fused to a ceramic substrate, the metal piece can be moved by being pulled upwardly with a relatively small force applied. The metal piece has a pair of pull tabs. For fabricating such a lead frame, the metal piece is stamped out of an integral metal plate structure having the leads and support frame integral with the leads. Then, the stamped metal piece is pushed back so as to fit with the leads of the lead frame.

REFERENCES:
patent: 4137546 (1979-01-01), Frusco
patent: 4415917 (1983-11-01), Chiba et al.

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