Microchannel-element assembly and preparation method thereof

Details Microchannel-element assembly and preparation method thereof Microchannel-element assembly and preparation method thereof

1998-08-06

2000-08-08

Wilczewski, Mary

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438456, 438745, H01L 21302

Patent

active

061001074

ABSTRACT:
A preparation method for an integrated assembly of a microchannel and an element is disclosed. In the preparation method of this invention, an element is prepared between a substrate and a sacrificial layer. Two protection layers, which are resistant to etchant for said substrate and said sacrificial layer, are prepared to isolate said element from its ambient environment. Said sacrificial layer defines an area to be etched off such that a microchannel may be formed. A coating layer with etching windows is then prepared on said sacrificial layer and the assembly is etched in an etchant to etch off said sacrificial layer and an area of said substrate beneath said sacrificial layer. An integrated assembly of a closed microchannel and an element is then accomplished. In the invented method, no bonding process is necessary and the integrated assembly so prepared has a planarization surface. This invention also disclosed a microchannel-element assembly prepared under the method of this invention.

REFERENCES:
patent: 4706061 (1987-11-01), Johnson
patent: 5285131 (1994-02-01), Muller et al.
patent: 5620929 (1997-04-01), Hosoi et al.
patent: 5844287 (1998-12-01), Hassan et al.
patent: 5855801 (1999-01-01), Lin et al.
patent: 5956003 (1999-09-01), Fisher

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