Hybrid integrated-circuit device having an asymmetrical thermal

Details Hybrid integrated-circuit device having an asymmetrical thermal Hybrid integrated-circuit device having an asymmetrical thermal

1992-03-12

1993-11-09

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257713, 257718, 257719, 361380, 361381, 361386, 361388, 361389, 361702, 361711, 361719, H01L 3902, H01L 2302, H02B 100, H05K 500

Patent

active

052606023

ABSTRACT:
A hybrid integrated circuit device includes first and second circuit boards having heat emitting semiconductor devices mounted on each circuit board, the circuit boards being respectively attached to opposite sides of a heat radiating plate with an adhesive and extending in opposite directions beyond the heat radiating plate. The respective edges of the circuit boards extending beyond the heat radiating plate are grasped by clip leads for supporting the heat radiating plate and the two circuit boards on a main circuit board. Further, these clip leads electrically connect the semiconductor devices to external circuits.

REFERENCES:
patent: 4867235 (1989-09-01), Grapes et al.
patent: 5050039 (1991-09-01), Edfors

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