Distributed-array magnetron-plasma processing module and method

Details Distributed-array magnetron-plasma processing module and method Distributed-array magnetron-plasma processing module and method

1990-08-02

1992-01-21

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429816, 20429819, 20429837, 118723, 156345, 156643, 31511141, 31511171, H01H 146, B01J 1912

Patent

active

050825429

ABSTRACT:
A semiconductor wafer plasma processing magnetron module (12) for magnetron-plasma-enhanced processing of semiconductor wafers comprises a base (50) and distributed magnet array (52). The magnet array (52) comprises a plurality of associated magnet unit cells (54). Unit cells (54) associated for producing a periodic magnetic field at the semiconductor wafer (22). The magnetron (12), including the magnetic array (52), mounts to base (50). Unit cells (54) form a repetitive pattern across the surface of magnet array (52). Magnetron module (12) produces a magnetic field possessing periodic uniformity. Unit cells (54) associate to permit expansion of magnet array (52) for any wafer size. A preferred embodiment of the invention includes a hexagonal configuration of magnets (56) and (58) that form unit cells (54).

REFERENCES:
patent: 4631106 (1986-12-01), Nakazato et al.
patent: 4632719 (1986-12-01), Chow et al.
patent: 4740268 (1988-04-01), Bukhman

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