Method for manufacturing semiconductor devices

Details Method for manufacturing semiconductor devices Method for manufacturing semiconductor devices

1994-01-26

1995-11-21

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

H01L 21306, B44C 122, C03C 1500

Patent

active

054683440

ABSTRACT:
The present invention is directed to a method for manufacturing semiconductor devices including a process of etching a member for use in making a semiconductor device. An improvement resides in a process for holding the member, using holding means which is placed into contact with the peripheries of the member, as well as forming a space including one face of the member, and a process for introducing a gas into the space, and blasting the gas from a clearance between the member and the holding means, as well as injecting an etching agent to the member from the opposite face side of the member to etch the other face of the member.

REFERENCES:
patent: 4473455 (1984-09-01), Dean et al.
patent: 4557785 (1985-12-01), Ohkuma
patent: 4759817 (1988-07-01), Aigo
patent: 4903717 (1990-02-01), Sumnitsch
patent: 5105556 (1992-04-01), Kurokawa et al.

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