Mounted structure of printed circuit board in semiconductor pack

Details Mounted structure of printed circuit board in semiconductor pack Mounted structure of printed circuit board in semiconductor pack

1998-03-23

1999-08-10

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

257780, 257781, 257783, 257786, 257714, 361767, 361768, 361771, 174261, H05K 118, H05K 114

Patent

active

059363096

ABSTRACT:
A mounted structure of printed circuit board in semiconductor package, the mounted structure comprising a solder resist formed with at least more than one tunnel connecting outsides with respective pads of printed circuit board mounted with substrate, whereby the solder resist is improved in construction thereof to allow the flux gas to be easily extracted for prevention of generation of void.

REFERENCES:
patent: 5493075 (1996-02-01), Chong et al.

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