Method of forming solder bumps

Details Method of forming solder bumps Method of forming solder bumps

1997-05-06

1999-02-02

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438106, 438118, 438126, 438615, H01L 2144

Patent

active

058664750

ABSTRACT:
An Al electrode pad and a photoresist pattern having an opening portion on the Al electrode pad on a semiconductor substrate on which a surface protective film has been formed are formed. Then, a barrier metal layer is formed on the whole substrate surface, and a resist film and the barrier metal layer on the resist film are removed by lift-off, thus forming a solder bump foundation layer. Furthermore, an adhesive tape is stuck to the substrate surface and then the adhesive tape is peeled off, thereby to perform a residue removing process for removing resist film residues and useless barrier metal residues other than the solder bump foundation layer. With this, it is possible to further remove residues that have remained on the substrate surface without being lifted off and caused a defective device with an adhesive tape, thus making it possible to form a solder bump of high reliability in flip chip bonding. In this way, there is provided a method of forming such a solder bump that is capable of flip chip bonding on a semiconductor device with high reliability.

REFERENCES:
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patent: 5034345 (1991-07-01), Shirahata
patent: 5137845 (1992-08-01), Lochon et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5393697 (1995-02-01), Chang et al.
patent: 5516704 (1996-05-01), Yoshida
patent: 5587336 (1996-12-01), Wang et al.

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