Method for manufacturing integrated semiconductor devices

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156631, 156633, 1566591, 156662, 156657, 437 5, 437209, 437229, 437238, H01L 21306, B44C 122, C03C 1500

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053856325

ABSTRACT:
An integrated semiconductor device is formed by bonding the conductors of one fabricated semiconductor device having a substrate to the conductors on another fabricated semiconductor device having a substrate, flowing an etch-resist in the form of a photoresist between the devices, allowing the etch-resist to dry, and removing the substrate from one of the semiconductor devices. Preferably the etch-resist is retained to impart mechanical strength to the device. More specifically, a hybrid semiconductor device is formed by bonding the conductors of one or more GaAs/AlGaAs multiple quantum well modulators to conductors on an IC chip, flowing a photoresist between the modulators and the chip, allowing the photoresist to dry, and removing the substrate from the modulator.

REFERENCES:
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patent: 5207864 (1993-05-01), Bhat et al.
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P. Barnes, P. Zouganeli, A. Rivers, M. Whitehead, G. Parry, K. Woodbridge, and C. Roberts, "GaAs/AlGaAs Multiple Quantum Well Optical Modulator Using Multilayer reflector Stack Grown on Si Substrate" in Electron. Lett., vol. 25, p. 995, 1989.
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J. Wieland, H. Melchior, M. Q. Kearley, C. Morris, A. J. Moseley, M. G. Goodwin, and R. C. Goodfellow "Optical Receiver Array in Silicon Bipolar Technology With Selfaligned, Low Parasitic III/V Detectors for DC-1 Gbits/s Parallel Links" in Electron Lett., vol. 27, p. 2211, 1991.
C. Camperi-Ginestet, M. Hargis, N. Jokerst, and M. Allen, "Alignable Epitaxial Liftoff of GaAs Materials with Selective Deposition Using Polymide Diaphragms", IEEE Photon. Tech. Lett., vol. 3, p. 1123, 1991.

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