Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1992-09-30
1994-11-15
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
118723ER, 118724, 118725, H01L 2100
Patent
active
053644883
ABSTRACT:
A plasma processing apparatus for ashing semi-conductors wafers has a vertically elongate cylindrical chamber for generating a plasma for processing a workpiece housed therein with heat applied thereto. The cylindrical chamber has upper and lower open ends closed respectively by upper and lower chamber plates. A cooling coil is positioned above the upper chamber plate. A temperature controller actuates a fan unit to force an air flow over the cooling coil to the upper chamber plate for keeping the temperature in the cylindrical chamber within a predetermined range. The plasma processing apparatus includes inner and outer electrodes disposed inside and outside, respectively, of the cylindrical chamber, and a Radio Frequency generator for generating the plasma between the inner and outer electrodes.
REFERENCES:
patent: 4782785 (1988-11-01), Gohla et al.
patent: 4838983 (1989-06-01), Schumaker et al.
patent: 5015330 (1991-05-01), Okumura et al.
patent: 5052472 (1991-10-01), Takahashi et al.
patent: 5097890 (1992-03-01), Nakao
patent: 5099100 (1992-03-01), Bersin et al.
patent: 5169478 (1992-12-01), Miyamoto et al.
Perry and Chilton, Chemical Engineers' Handbook, 5th Edition, 1973, pp. 22-72 to 22-73.
Matsushita Atsushi
Minato Mitsuaki
Uehara Akira
Baskin Jonathan D.
Breneman R. Bruce
Burt Pamela S.
Carrier Joseph P.
Tokyo Ohka Kogyo Co. Ltd.
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