Semiconductor device with thermally oxidized insulating and arse

Metal treatment – Barrier layer stock material – p-n type – With non-semiconductive coating thereon

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148DIG37, 437 40, 357 231, H01L 21425

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047463775

ABSTRACT:
In a surface region of a silicon semiconductor substrate (10), an arsenic diffusion layer (20) having a surface arsenic concentration of 5.times.10.sup.18 cm.sup.-3 to 5.times.10.sup.19 cm.sup.-3 is formed and then, the arsenic diffusion layer (20) is oxidized by a thermal oxidation method so that a thermally oxidized film (30) is formed on the arsenic diffusion layer (20). Thus, an insulating film (30) having an excellent insulating characteristic can be obtained, and therefore a MOS type semiconductor device with an excellent insulating characteristic can be obtained.

REFERENCES:
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patent: 4183134 (1980-01-01), Oehler et al.
patent: 4210689 (1980-07-01), Komatsu
patent: 4274892 (1981-06-01), Templin
patent: 4329773 (1982-05-01), Geipel, Jr. et al.
patent: 4676845 (1987-06-01), Spitzer
Gow, III et al., "Tunnel Diode Fabrication", IBM Tech. Disc. Bull., vol. 5, No. 12, (May 1963), p. 61.
Translation of the S. Morita et al., publication Proceedings, 14a-B-9, the 1984 Autumn Meeting of Japanese Applied Physics, p. 432.

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