Plastic molded type electronic device

Details Plastic molded type electronic device Plastic molded type electronic device

1990-11-13

1993-01-19

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

428413, 257793, H01L 2328

Patent

active

051810972

ABSTRACT:
The phenol resin molding composition used in the present invention is obtained by subjecting a resol-type phenol resin to purification until, when the resin is extracted by heating with 10 times the amount of hot water at 120.degree. C. for 100 hours or more, the extract has an electric conductivity of 100 .mu.S/cm or less, a pH of 4-7 and a halogen ion content of 10 ppm or less, then preparing a composition comprising a resin component consisting of said resol-type phenol resin and a cure rate controlling agent incorporated therewith, optionally incorporating a filler into said composition, kneading the resulting mixture, and then grinding the kneaded mixture. The composition has a good moldability and, when used for resin-sealing of electronic devices or semiconductor devices and transfer-molding of electronic devices using resin, exhibits an excellent adhesive property, electric properties, moisture resistance and heat resistance.

REFERENCES:
patent: 4248920 (1981-02-01), Yoshizumi et al.
patent: 4367318 (1983-01-01), Ishimura et al.
patent: 4596840 (1986-06-01), Hesse et al.

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