Method of fabricating glass substrate for disk

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156651, 156654, 1566591, 156663, 21912169, 430321, B44C 122, C03C 1500, C03C 2506

Patent

active

052465314

ABSTRACT:
A method of fabricating a glass substrate for a disk including guide track portions and sector (or track) address portions of which grooves and pits have different depths, providing the steps of (i) forming a photoresist film over a glass substrate for an optical memory element, (ii) carrying out exposure to define a plurality of guide track portion formation areas and sector (or track) address portion formation areas interposed between the guide track portion formation areas, and carrying out development so as to cause the glass substrate in the address portion formation area to appear and to cause the photoresist film in the guide track portion formation area to remain as a first residual film, (iii) carrying out first etching to sink the glass substrate in the address portion formation area by a predetermined thickness such that a pit is formed and to remove the surface layer of the first residual film such that a second residual film is formed, (iv) carrying out first ashing to remove the second residual film so that the glass substrate in the guide track portion formation area appears, (v) carrying out second etching to form a groove in the guide track portion formation area and to further sink the pit in the address portion formation area so that a deeper pit is formed, and (vi) carrying out second ashing to remove a third residual photoresist film which remains between the deeper pit and the groove.

REFERENCES:
patent: 4818648 (1989-04-01), Ohta et al.
patent: 4839251 (1989-06-01), Ohta et al.
patent: 5008176 (1991-04-01), Kondo et al.

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