Method of aerosol jet etching

Details Method of aerosol jet etching Method of aerosol jet etching

1988-12-21

1990-11-27

Lacey, David L.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

239 13, H01L 21306

Patent

active

049733796

ABSTRACT:
A device and method for etching a body are provided capable of etching fine geometry patterns utilizing the high selectivity of wet etching and the anisotropic etch characteristics of dry etching. The body to be etched is placed in a reduced pressure etching chamber. An inert carrier gas is bubbled through heated liquid etchant producing a vapor stream of liquid etchant. A non-reactive gas is chilled producing a cold gas stream. The vapor stream and the cold gas stream are combined in an aerosol generation nozzle producing a high concentration of fine aerosol particles by homogeneous nucleation. The fine aerosol particles enter an aerosol growth chamber and form larger particles through thermal coagulation. The larger particles are accelerated out of the growth chamber through an expansion nozzle positioned within the reduced pressure etching chamber and directed toward the body to be etched. This aerosol jet of etchant impacts the surface of the body to be etched. The small size of these larger particles allows for etching fine geometry patterns. Additionally, aerosol jet etching avoids the need to rinse the body after being etched as required in wet etching to halt the etching process.

REFERENCES:
patent: 3616049 (1971-10-01), Moore et al.
patent: 3935041 (1976-01-01), Goffredo et al.
patent: 4053351 (1977-10-01), DeForest et al.
patent: 4092262 (1978-05-01), Reusser
patent: 4383645 (1983-05-01), Figiel et al.
patent: 4609575 (1986-09-01), Burkman
patent: 4734157 (1988-03-01), Carbaugh et al.
patent: 4741799 (1988-05-01), Chen et al.
J. A. Butora and C. J. Owen, Circuit Etching Process, IBM Technical Disclosure Bulletin, vol. 12, No. 9, 2/1970, p. 1515.
Rivaud et al., "Pulsed-Jet Etch Chamber for Preparing Silicon Samples for Transmission Electron Microscopy", Rev. Sci. Instrum., vol. 56, (1985) 563-566.
Cheng et al., "Particle Bounce in Cascade Impactors", Environ, Sci. Tech., vol. 13, (1979) 1392-1396.
Dialog Search Report.
Chen et al., "Aerosol Jet Etching of Fine Patterns", Appl. Phys. Lett. vol. 51, (1987), 2203-2205.
Jun-Ru et al., "A New Confirmational Dry-Etch Technique for Submicrometer Structures", J. Vac. Sci. Technol., vol. 19 (1981) 1385-1389.
Barker et al., "Surface Studies of and a Mass Balance for Ar.sup.+ Ion Assisted Cl.sub.2 Etching of Si", J. Vac. Sci. Technol. B, vol. 1 (1983), 37-42.
Geis et al., "Hot Jet Etching of GaAs and Si", J. Vac. Sci. Technol. B, vol. 4, (1986), 315-317.

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