Micromachined bonding surfaces and method of forming the same

Details Micromachined bonding surfaces and method of forming the same Micromachined bonding surfaces and method of forming the same

1989-10-17

1991-09-03

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156648, 156651, 156653, 156657, 1566591, 156662, 252 793, 357 55, 357 69, 357 72, 437 68, 437211, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

050451510

ABSTRACT:
A method of encapsulating a lead bonding pad region of an integrated circuit (such as a sensor used in an implantable medical device) is disclosed. The excapsulant (such as Teflon.TM.-TFE) is mechanically gripped on the surface of the circuit by anchor interlock portions which are held in undercut grooves, micromachined, in a predefined pattern, in the circuit substrate. The encapsulant is held down by the portions in the grooves, forms a tight mechanical seal with the substrate surface and with the insulation around an attached lead, and blocks intrusion of contaminants along the surfaces between these materials or through the encapsulant.

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