Method of fabricating channel plates and ink jet printheads cont

Details Method of fabricating channel plates and ink jet printheads cont Method of fabricating channel plates and ink jet printheads cont

1990-05-16

1991-08-20

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156651, 156657, 1566611, 156662, 437226, 346140R, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

050411900

ABSTRACT:
A method of fabricating channel plates for ink jet printheads from a (100) silicon wafer is disclosed. The location of the nozzle-forming channels are accurately located relative to side edges of each channel plate to permit extended arrays of printheads containing these channel plates to be fabricated without discrepancies between the spacing of end nozzles of adjacent subunits. The present invention achieves this result by forming a first set of base etch openings and a second set of base etch openings on a base surface of a (100) silicon wafer. The first set of base etch openings define the locations of side edges of each channel plate. The second set of base etch openings define the locations and dimensions of a plurality of nozzle-defining channels for each channel plate. By aligning the second set of base etch openings with the first set of base etch openings, the channel plates which are formed after etching the silicon wafer have nozzle-defining channels which are precisely aligned with the side edges of each channel plate.

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patent: 4961821 (1990-10-01), Drake et al.

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