Zone polishing using variable slurry solid content

Details Zone polishing using variable slurry solid content Zone polishing using variable slurry solid content

2007-01-16

2007-01-16

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S287000, C451S446000

Reexamination Certificate

active

11208829

ABSTRACT:
A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.

REFERENCES:
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patent: 6106728 (2000-08-01), Iida et al.
patent: 6234877 (2001-05-01), Koos et al.
patent: 6398627 (2002-06-01), Chiou et al.
patent: 6946392 (2005-09-01), Sinha

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