Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-03-01
2005-03-01
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S200000, C257S201000, C257S198000, C438S603000, C438S604000
Reexamination Certificate
active
06861342
ABSTRACT:
An underlayer made of a III-V semiconductor compound is formed on a given substrate, and a CrSb compound is epitaxially grown on the underlayer by means of MBE method to fabricate a zinc blend type CrSb compound.
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Zhao, J. H. et al., “Room-temperature ferromagnetism in zincblende CrSb grown by molecular-beam epitaxy,” Applied Physics Letters, vol. 79, No. 17, Oct. 22, 2001, pp. 2776-2778.
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Radhakrishna, P. et al., “Inelastic-neutron-scattering studies of spin-wave excitations in the pnictides MnSb and CrSb,” Physical Review B, vol. 54, No. 17, Nov. 1, 1996, pp. 11949-11943.
Dohnomae, H. et al., “Structural and magnetic properties of Cr/Sb multilayers,” Applied Surface Science 60/61 (1992), pp. 807-812.
Matsukura Fumihiro
Ohno Hideo
Le Dung A.
Oliff & Berridg,e PLC
Tohoku University
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